· Responsible for the formulation of technical solutions and process improvement of high-speed device packaging process;
· Responsible for the development of devices and the proposal of technical solutions in the production process;
· Strictly implement the quality management standard, propose to improve the device process, improve the product yield, and reduce the production cost.
· Bachelor degree or above, major in microelectronics, semiconductor physics, electronic engineering or related;
· At least 3 years experience in optical device packaging;
· Familiar with semiconductor optoelectronic device packaging technology;
· Strong communication skills, team spirit and sense of responsibility;
· Good English reading and writing skills.
Domestic Customer Account Manager2023-01-06 Next
Senior Electronic Engineer / Electronic Engineer2023-02-14