With the rapid growth of cloud computing, artificial intelligence (AI), 5G, and the Internet of Things (IoT), global data traffic is increasing exponentially. As the core infrastructure of the digital era, data centers now require optical communication technologies that offer higher speed, greater density, and lower latency. Against this backdrop, the 1.6T OSFP-XD optical module has emerged as a representative product of next-generation optical communication.
While OSFP1600 supports future switch chips with 200 Gb/s electrical lanes, there is strong market interest in 1.6 Tb/s optical modules based on the existing 100 Gb/s electrical lane ecosystem.
This demand has led to the emergence of the OSFP-XD (eXtra Dense) form factor. By increasing the number of electrical lanes from 8 to 16, OSFP-XD enables 1.6T capacity (16×100 Gb/s) and is also ready for 3.2T capacity (16×200 Gb/s) in the future.
With these capabilities, OSFP-XD supports a wide range of system configurations. In summary, OSFP-XD doubles the front-panel density compared to 8-lane OSFP or QSFP-DD form factors.
The 1.6T OSFP-XD DR8 optical module marks a major breakthrough in high-speed optical communication, supporting an impressive data rate of up to 1.6 Tbps (terabits per second).
Based on the OSFP-XD (Octal Small Form-factor Pluggable – eXtended Density) form factor, this module integrates advanced technologies and is purpose-built to meet the growing bandwidth demands of modern data centers, cloud computing, and AI workloads.
Its DR8 architecture uses 8 parallel channels and delivers powerful performance over single-mode fiber, making it especially well-suited for long-reach interconnect applications.
As data centers scale to handle massive data volumes driven by AI, machine learning, and 5G applications, the need for higher bandwidth and lower latency has surged. The 1.6T OSFP-XD DR8 module addresses these needs by providing double the bandwidth of its 800G predecessors while maintaining compatibility with existing infrastructure. Its role in enabling high-density, high-efficiency networking positions it as a cornerstone for next-generation data center architectures.
The 1.6T OSFP-XD DR8 optical module achieves a total bandwidth of 1.6 Tbps through 8 parallel channels, each operating at a data rate of up to 212.5 Gb/s. This high-speed transmission is made possible by PAM4 (4-level Pulse Amplitude Modulation) technology, which encodes 2 bits of data per symbol. Compared to traditional NRZ modulation, PAM4 doubles the bandwidth efficiency.
PAM4 technology not only increases data rates and improves spectral efficiency but also reduces the demand for fiber resources. It has become the mainstream modulation format for high-speed optical communication.
At the same time, the module ensures reliable data transmission through signal integrity control at high data rates, meeting the needs of high-throughput and low-latency intra-data center connections.
At the core of the module is an EML (Electro-Absorption Modulated Laser), which combines the stability of a DFB laser with the high-speed modulation capabilities of an EAM. This design offers key advantages such as low power consumption, high linearity, and low noise.
In addition, by integrating EML with silicon photonics technology, the module achieves a smaller package size, lower manufacturing cost, and improved power efficiency.
This combination not only supports short-reach data center interconnects up to 500 meters, but also scales to metro network (MAN) and data center interconnect (DCI) applications over distances of 10 to 40 kilometers.
OSFP-XD is a next-generation pluggable form factor designed for ultra-high-density deployments. It offers the following features:
Hot-pluggable capability: Modules can be installed or replaced without interrupting system operation, improving maintenance efficiency and flexibility.
Compact structure with optimized thermal performance: Compared to traditional OSFP modules, OSFP-XD features higher connector density and improved airflow design, enabling stable operation at power levels between 20 and 30W.
High-density port configuration: While maintaining the same physical size as OSFP, OSFP-XD supports higher-density layouts—such as 64 OSFP ports in a 1U chassis—enabling switch capacities up to 51.2 Tbps.
The module is designed with backward compatibility and system scalability in mind. It supports seamless interoperability with existing 800G OSFP modules, simplifying system upgrades. Its ability to coexist and stack with other OSFP or OSFP-XD modules on the same board enables flexible network topologies and configuration combinations.
Additionally, the pluggable architecture retains the key advantages of traditional optical modules—ease of maintenance, configurability, and upgradability—aligning well with current procurement practices in carrier and data center environments.
To meet growing bandwidth demands, the module adopts advanced power management strategies. Typical power consumption is maintained within the 20–30W range. Efficient thermal design and airflow guidance help address heat dissipation challenges in high-density deployments. Looking ahead, the evolution path is clear—advancements in DSP technology toward 3nm and 2nm processes are expected to reduce power consumption to 5–6 pJ/bit, further enhancing overall system energy efficiency.
The 1.6T OSFP-XD DR8 optical module strictly complies with the 1600G Ethernet technical specifications and the OSFP-XD Multi-Source Agreement (MSA) standard.
1600G Ethernet: As the next-generation Ethernet interface standard, it defines an aggregated rate of 1.6 Tb/s and supports ultra-high-speed upgrades for data center backbone networks.
OSFP-XD MSA: A packaging standard jointly developed by leading industry manufacturers to ensure mechanical, electrical, and optical compatibility among modules from different suppliers, reducing procurement and deployment risks for users.
The 1.6T OSFP-XD DR8 optical module integrates core breakthroughs such as PAM4 modulation, high-speed EML lasers, silicon photonic integration, and OSFP-XD high-density packaging. It achieves ultra-high-speed, low-power, and high-density data transmission capabilities. It also offers excellent system compatibility and future scalability. These features make it a key optical interconnect solution for next-generation AI computing and hyperscale data centers.
| 1.6T OSFP DR8 Specification | |||
| Part Number | OXD-1T6S831-02CM | Data Rate | 1×1.6T, 2xDR4 |
| Form Factor | OSFP-XD | Wavelength | 1310nm SMF |
| Distance | 500m | Connector | Dual MPO-12 |
| Modulation (Optical) | Dual 4x200G-PAM4 | Modulation (Electrical) | 8x200G-PAM4 |
| Modulation | PAM4 | Voltage Supply | 3.3V |
| Transmitter Type | 1310nm EML laser | Max Power Consumption | 33.5W |
| Protocols | OSFP1600 MSA | Application | 1.6T-to-1.6T Links |
The 1.6T OSFP-XD optical module is designed for a wide range of high-speed networking applications. Its advanced performance, scalability, and energy efficiency make it ideal for the following scenarios.
In the data centers of cloud computing giants and internet companies, the 1.6T optical module can be deployed on core switches and backbone links of the Leaf-Spine architecture, supporting high-bandwidth services such as AI training and big data analytics. For example, in distributed machine learning scenarios, its low-latency feature accelerates parameter synchronization between nodes, improving model training efficiency.
In Data Center Interconnect (DCI) scenarios, the 1.6T OSFP-XD DR8 module provides high-speed, low-latency connections among servers, switches, and storage systems. It meets the stringent requirements for large-volume data transmission of cloud service providers and hyperscale data centers.
HPC systems are highly sensitive to inter-node communication bandwidth. The DR8 module’s 1.6T bandwidth effectively meets massive data exchange requirements between GPU/TPU clusters, eliminating computing resource idle time caused by network bottlenecks. With exceptional bandwidth and ultra-low latency, this module is ideally suited for AI training clusters and HPC environments, enabling large-scale data processing and model training.
In cloud computing environments, the 1.6T OSFP-XD optical module supports high-density network connections, ensuring the stability and reliability of cloud services. At the same time, it meets the high-speed data transmission demands of cloud storage systems, improving data read/write performance.
For enterprises and data centers seeking to expand network capacity and enhance performance, the 1.6T OSFP-XD optical module can be seamlessly integrated into existing network architectures. It delivers higher bandwidth and lower latency, meeting the demands of future network scalability.
The module supports both 1.6T Ethernet and InfiniBand protocols, making it widely applicable across various network architectures. Its strong compatibility enables smooth integration into both current and future networks, offering excellent scalability.
The 1.6T OSFP-XD optical module is widely applicable in scenarios requiring high-speed data transmission, driving digital transformation and innovation across various industries. The 1.6T OSFP-XD features a high channel count, low power consumption, and optimized compatibility.
These advantages make it a key component in next-generation data center networks. It is especially well-suited for AI/ML applications that require high bandwidth and low latency. Its technical roadmap is clear, and it is expected to become a mainstream choice by 2025 alongside the adoption of 200G SerDes chips.
The transition from 800G to 1.6T modules reflects the industry’s response to the continuous demand for increased bandwidth. Building on the success of 800G modules, the 1.6T OSFP-XD DR8 further enhances capacity while addressing challenges in power consumption and thermal management.
The 1.6T module faces significant challenges in signal integrity, power management, and thermal design. Although technologies such as PAM4, EML, and silicon photonics have greatly mitigated these issues, ongoing innovation is needed to ensure sustained performance.
The industry is already charting the path toward 3.2T optical modules. The scalable architecture and forward compatibility of the 1.6T OSFP-XD DR8 provide a solid foundation for this evolution and will help drive future standardization. Its compatibility with existing protocols ensures adaptability to evolving network requirements.
The demand for optics modules is largely driven by the major cloud service providers. The next few years are expected to see rapid adoption in 800G modules as shown in the market forecast below for expected sales to the five largest cloud service providers. It is important to note that the majority of 800G optics modules initially will be used for break-out applications including dual 400G and octal 100G.
There are no market forecasts yet for 1600G modules, but one can expect a fast ramp once 1600G modules are being adopted by large cloud service providers. Similar to the 800G case, the majority of 1600G modules will be used for break-out applications.
The OSFP MSA roadmap provides an excellent mechanical and electrical solution for 800G, 1.6T, and 3.2T pluggable optics with best-in-class thermal performance and support for break-out applications, making these form factors a great choice to deliver the next-generations of pluggable optics modules.
High-speed modules tend to consume significant power. By integrating low-power EML lasers and advanced power management circuits, the power consumption of a single module is kept below 20W, achieving a balance between performance and energy efficiency.
The compact OSFP-XD form factor is prone to thermal issues and signal interference. Innovative PCB layout and high-performance materials are employed to ensure stable operation under high-density deployments.
Maintaining signal integrity at a channel rate of 212.5 Gb/s is crucial. By combining PAM4 modulation, advanced DSP chips, and error correction technologies, reliable transmission over long distances is achieved.
The 1.6T OSFP-XD DR8 optical module redefines high-speed connectivity with 1.6Tbps bandwidth, 20-30W power efficiency, and ultra-high-density packaging. By integrating PAM4, EML lasers, and silicon photonics, it addresses the explosive demands of AI and hyperscale data centers while ensuring seamless upgrades through backward compatibility.
With future advancements like 3nm/2nm DSP chips promising 5-6pJ/bit efficiency, this technology is poised to lead the transition to 3.2T networks, solidifying its role as the backbone of tomorrow’s digital infrastructure.
